Structural component and method for producing a structural component

US9252344B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Thomas Kippes · Dresden, DE
• Stephan Haslbeck · Regensburg, DE
• Annaniah Luruthudass · Bukit Mertajam, MY
• Ee Lian Lee · Balik Pulau, MY

Key dates

• Filing date: Apr 12, 2012
• Grant date: Feb 2, 2016
• Expiry date: Apr 12, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/8592

Abstract

The invention relates to a structural component which comprises a support (1), an optoelectronic semiconductor chip (2) having at least one lateral face (2a), further comprising a connecting means (3), a first molded element (4), and a second molded element (5), the optoelectronic semiconductor chip (2) being mechanically connected to the support (1) by the connecting means (3). The first molded element (4) covers an exposed outer face of the optoelectronic semiconductor chip (2) and the first molded element (4) covers an exposed outer face of the connecting means (3). The second molded element (5) covers an exposed outer face of the first molded element (5) and the second molded element (5) has a higher modulus of elasticity at room temperature than the first molded element.