High frequency high isolation multichip module hybrid package
US9252734B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2013 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Sep 2, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a high frequency module may include a substrate. The substrate may include a first surface and a second surface substantially opposite of the first surface. The high frequency module may include a component coupled to the second surface. A direct current may be provided to the component using the substrate. The high frequency module may include a core coupled to the second surface of the substrate. In some embodiments, the core may include at least one opening extending through the core. The component may be positioned in at least one of the openings. In some embodiments, the high frequency module may include a cover coupled to the core. The component may be positioned in at least one of the openings between the substrate and the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.