Panel for enhancing thermal conduction in an electronic assembly
US9253925B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 11, 2013 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Oct 25, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly can include a support structure, a circuit substrate coupled to a first portion of the support structure, and a composite material panel coupled to a second portion of the support structure. An electronic device can be coupled to a mounting surface of the circuit substrate and disposed within a space enclosed by walls of the support structure. The panel can include contiguous sections inner surfaces of which can be oriented within twenty-five degrees of parallel to said mounting surface. Each section can be significantly more thermally conductive generally parallel to the inner surface of the section than generally perpendicular to the inner surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.