Dielectric material for temperature compensation and method of preparing the same
US9255034B1 · kind B1 · utility
0Cited by
5References
5Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 15, 2014 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Sep 15, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/3293
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention provides a dielectric material for temperature compensation of Chemical Formula 1 and a method of preparing the same.(Ba1-a-b-3c/2SraMgbLac)(Ti1-xSnx)O3 Chemical Formula 1In the above Chemical Formula 1, a is 0≦a<0.20; b is 0<b <0.05; c is 0<c<0.01; and x is 0<x<0.20 as defined in the detailed description.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.