Patent · US Active

Cutting tool insert

US9255312B2 · kind B2 · utility

3Cited by

7References

17Claims

0Family size

Inventors

John H. Liversage · Randburg, ZA
Iain Patrick Goudemond · Sandton, ZA
Danny E. Scott · Conroe, US

Key dates

Filing date	Apr 8, 2009
Grant date	Feb 9, 2016
Priority date	—
Expiry date	Apr 13, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/30
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A polycrystalline diamond (PCD) compact and method for making the compact are provided. The method includes bringing a first PCD wafer and a second PCD wafer together at an interface in the presence of a bonding agent to form an unbonded assembly and bonding the wafers together at the interface at a pressure and temperature at which diamond is thermodynamically stable. The first PCD wafer is more thermally stable than the second PCD wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.