Slider assembly and method of manufacturing same
US9257138B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2014 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Oct 28, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0465
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate assembly includes a chip coupled with a carrier, a substrate having a first surface and an opposing second surface, and a support structure mounted to the second surface of the substrate and in contact with the carrier. A method of bonding a chip and carrier assembly to a substrate includes contacting the chip and carrier assembly with the bond material and applying heat and force on the chip and carrier assembly until the support structure is mounted on the second surface of the substrate and in contact with the carrier. A substrate assembly includes a chip coupled with a carrier, a substrate having a first surface and an opposing second surface, and one of the carrier or the substrate comprising a trench having a periphery, wherein the second surface of the substrate supports the carrier along the periphery of the trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.