Process of forming transparent conductive coatings with sintering additives
US9257211B2 · kind B2 · utility
1Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2011 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Sep 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/22
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process is disclosed for the delayed sintering of metal nanoparticles in a self-assembled transparent conductive coating by incorporating a sintering additive into the water phase of the emulsion used to form the coating. The sintering additive reduces the standard reduction potential of the metal ion of the metal forming the nanoparticles by an amount greater than 0.1V but less than the full reduction potential of the metal ion. Emulsion compositions used in the process are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.