Method for embedding a chipset having an intermediary interposer in high density electronic modules
US9257355B2 · kind B2 · utility
4Cited by
0References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2014 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Feb 11, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for creating a high density electronic module including the steps of coupling a die to an interposer for form a chipset, mounting the chipset to a substrate, coupling a wafer to the substrate so that the chipset is within a window formed in the wafer, filling the window with encapsulant to encapsulate the chipset, removing the substrate to create a reconstructed wafer, and providing an interconnection structure on the interposer to form the high density electronic module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.