Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules
US9257467B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2010 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Dec 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.