Epoxy resin composition and light-emitting device package comprising the same
US9257621B2 · kind B2 · utility
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13Claims
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Assignee
Inventors
Key dates
| Filing date | Aug 25, 2014 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Aug 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition according to an embodiment of the present invention comprises an epoxy resin, 0.05-190 parts by weight, based on 10 parts by weight of the epoxy resin, of a polyester-based curing agent, wherein the epoxy resin comprises a triazine derivative epoxy compound and a siloxane compound containing an alicyclic epoxy group and a siloxane group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.