Light emitting diode package
US9257624B2 · kind B2 · utility
6Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2015 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Apr 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting diode package includes a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.