Hybrid interconnect
US9257763B2 · kind B2 · utility
1Cited by
179References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2013 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Dec 31, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connector for connection to terminals of an integrated circuit. The connector consists of a dielectric substrate having a first side and a second side. The connector has wire bond terminals which are attached to the first side of the substrate and configured to receive wire bonds connected to a first set of the terminals of the integrated circuit. The connector also has solder bump terminals, attached to the second side of the substrate so as to be insulated from the wire bond terminals, the solder bump terminals being configured to be coupled via solder balls with a second set of the terminals of the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.