Embedded electronic device and method for manufacturing an embedded electronic device
US9258898B2 · kind B2 · utility
0Cited by
1References
10Claims
0Family size
Inventor
Key dates
| Filing date | May 5, 2014 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | May 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/064
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.