Patent · US Active

Method for installing microwire

US9258901B2 · kind B2 · utility

0Cited by
3References
10Claims
0Family size

Assignee

Inventor

Key dates

Filing dateDec 19, 2013
Grant dateFeb 9, 2016
Priority date
Expiry dateDec 19, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/53213
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.