Lead-free solder and electronic component built-in module
US9258905B2 · kind B2 · utility
0Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2011 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | May 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3485
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A first solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy. An electronic component built-in module may include an electronic component and a substrate on which the electronic component is installed, where a terminal of the electronic component and a terminal of the substrate are joined together by using the lead-free solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.