System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9258926B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Jun 24, 2015 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Jun 24, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and method for cooling electronic devices disposed with the innermost volume of a hollow-walled fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes within the hollow walls of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The innermost volume of the sealed container contains one or more single phase or multi-phase dielectric thermally conductive fluids, which may be circulated passively by convection or actively by means of a pump, bubbler, fan, propeller or other means. Pressure balancing mechanisms may be included to maintain suitable pressure of gaseous fluid in the innermost volume of the sealed container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.