Heat transfer arrangement and electronic housing comprising a heat transfer arrangement
US9258927B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2009 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Dec 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer arrangement for heat exchange between an inside of an electronic component housing and an ambient environment. The heat transfer arrangement comprises a refrigerant circuit with an evaporator a condenser and conduits (202). A refrigerant is arranged to self-circulate in a refrigerant flow in the refrigerant circuit. A flow control device (124) comprises a movable member (206) adapted to control the refrigerant flow. The movable member (206) affects a through flow area of one of the conduits (202). The movable member (206) is adapted to move in response to a pressure change inside the refrigerant circuit by being affected from a first side by a refrigerant pressure inside the refrigerant circuit and from a second side by a spring force such that the refrigerant flow is changed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.