Patent · US Active

Method for connecting substrates, and composite structure obtainable thereby

US9259905B2 · kind B2 · utility

2Cited by

8References

19Claims

0Family size

Assignee

Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

Ralph Wilken · Rastede, DE
Jörg Ihde · Lilienthal, DE
Christoph Regula · Bremen, DE

Key dates

Filing date	Nov 17, 2011
Grant date	Feb 16, 2016
Priority date	—
Expiry date	Jun 4, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31663
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

The invention relates to a method for connecting substrates including depositing a plasma polymer layer on each of a first and a second substrate by means of atmospheric pressure plasma and bringing the plasma polymer layers in contact with each other. In a variant of the method, only the first substrate is provided with a plasma polymer layer and connected to a second substrate, the surface of which can react with the plasma polymer layer. The invention further relates to composite structures which can be obtained with such methods.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.