Assembly to selectively etch at inkjet printhead
US9259932B2 · kind B2 · utility
1Cited by
13References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2011 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Aug 28, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24612
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An assembly for selectively etching an inkjet printhead includes a substrate and printhead layers formed on the substrate. A bonding region can provide a location on the printhead layers for an electrical bond. An ink channeling region can be defined at least in part by the printhead layers. A mask layer can partially cover the printhead layers and include a first opening positioned over the bonding region and a second opening positioned over the ink channeling region. The assembly can also include a via at the first opening and a trench at the second opening having greater depth than the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.