Thermal interface materials including thermally reversible gels
US9260645B2 · kind B2 · utility
23Cited by
18References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 23, 2010 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Jun 8, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Thermal interface materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a thermal interface material includes at least one thermally conductive filler in a thermally reversible gel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.