Optical components including bonding slots for adhesion stability
US9261652B2 · kind B2 · utility
0Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2013 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Oct 2, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4246
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An opto-electronic apparatus comprises a substrate for supporting a plurality of components forming an opto-electronic assembly and an optical component attached to the substrate with an adhesive material, such as a solder or epoxy. The optical component is formed to include a plurality of bond slots disposed in parallel across at least a portion of the bottom surface of the optical component, the plurality of bond slots providing a path for a liquid adhesive material and improving the ability to displace the liquid adhesive material as the component is pressed into the surface of the substrate during the attachment process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.