Patent · US Active

Heat pipe assemblies

US9261924B2 · kind B2 · utility

1Cited by

21References

20Claims

0Family size

Assignee

DELL INC. · CA

Inventors

David William Grunow · Round Rock, US
Daniel W. Kehoe · Cedar Park, US
Matthew B. Mendelow · Austin, US

Key dates

Filing date	Sep 5, 2013
Grant date	Feb 16, 2016
Priority date	—
Expiry date	May 16, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49126
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and a daughterboard coupled to the motherboard and including a Graphics Processing Unit (GPU) coupled to a second side of the heat pipe. In other embodiments, a method may include providing a motherboard including a CPU; coupling a cooling system to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and coupling a daughterboard to the motherboard, the daughterboard including a GPU coupled to a second side of the heat pipe.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.