Wire constructs
US9263172B2 · kind B2 · utility
5Cited by
20References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 16, 2012 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Nov 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B13/0013
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for forming a wire construct includes forming a groove in a polymer having a mouth that is narrower than a width of a deeper portion of the groove and placing a substantial length of wire in the groove, the wire having a larger cross-sectional dimension than the mouth of the groove. Encapsulant is placed over the polymer. The wire construct is to be used for implantable stimulation leads, such as a cochlear stimulation lead or a neurostimulation lead. Two wire constructs can be assembled to form a multilayer wire construct.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.