Internal stack-up structure of touch panel and method for producing the same
US9263202B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2010 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Oct 18, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an internal stack-up structure of a touch panel including a touch sensing substrate having a joint area with an electronic assembly placed thereon; a cover substrate facing to and being spaced out from the touch sensing substrate and having a first border region with a first mask layer coated thereon, the first border region corresponding to the joint area; a reflection layer disposed on the first mask layer and corresponding to the electronic assembly; and a bonding layer formed at least between the electronic assembly and the reflection layer, the bonding layer being formed by liquid bonding materials which change from liquid state to solid state to improve the bonding strength between the cover substrate and the touch sensing substrate after being exposed to light reflected from the reflection layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.