Plasma processing apparatus and method thereof
US9263237B2 · kind B2 · utility
0Cited by
7References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 28, 2011 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Apr 11, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/321
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The following description relates to a plasma processing apparatus and a method thereof. The plasma processing apparatus comprises a first plasma chamber having a first plasma discharge space, a first plasma source for supplying a first activation energy to the first plasma discharge space within the first plasma chamber, a second plasma chamber which is connected to the first plasma chamber and has a second discharge space, and a second plasma source for supplying a second activation energy for inducing inductive coupled plasma to the second plasma discharge space within the second plasma chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.