Patent · US Active

Interlayer communications for 3D integrated circuit stack

US9263422B2 · kind B2 · utility

4Cited by

3References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Guido Droege · Braunschweig, DE
Niklas Linkewitsch · Evessen, DE
Andre Schaefer · Hersbruck, DE

Key dates

Filing date	Jan 16, 2015
Grant date	Feb 16, 2016
Priority date	—
Expiry date	Jan 16, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2225/06544
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Some embodiments provide capacitive AC coupling inter-layer communications for 3D stacked modules.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.