Enhanced adhesion of seed layer for solar cell conductive contact

US9263601B2 · kind B2 · utility

Assignee

• SUNPOWER CORPORATION · US

Inventors

• Junbo Wu · Palo Alto, US
• Michael C. Johnson · Alameda, US
• Michael Cudzinovic · Sunnyvale, US
• Joseph Behnke · San Jose, US
• Xi Zhu · 红钢城街道, CN
• David D. Smith · Dublin, US
• Richard Sewell Hamilton · Los Altos, US
• Xiuwen Tu · San Jose, US
• Seung Bum Rim · Pleasanton, US

Key dates

• Filing date: Dec 21, 2012
• Grant date: Feb 16, 2016
• Expiry date: Aug 21, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/547

Abstract

Enhanced adhesion of seed layers for solar cell conductive contacts and methods of forming solar cell conductive contacts are described. For example, a method of fabricating a solar cell includes forming an adhesion layer above an emitter region of a substrate. A metal seed paste layer is formed on the adhesion layer. The metal seed paste layer and the adhesion layer are annealed to form a conductive layer in contact with the emitter region of the substrate. A conductive contact for the solar cell is formed from the conductive layer.