Patent · US Active

Metal plating composition and method for the deposition of copper—zinc—tin suitable for manufacturing thin film solar cell

US9263609B2 · kind B2 · utility

0Cited by

6References

19Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Holger Kühnlein · Simbach, DE
Jörg Schulze · Liegau-Augustusbad, DE
Torsten Voss · Glienicke, DE

Key dates

Filing date	May 15, 2007
Grant date	Feb 16, 2016
Priority date	—
Expiry date	Jun 19, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E10/541
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

To be able to form a copper-zinc-tin alloy which optionally comprises at least one chalcogenide and thus forms a semiconductor without the use of toxic substances a metal plating composition for the deposition of a copper-zinc-tin alloy is disclosed, wherein said metal plating composition comprises at least one copper plating species, at lease one zinc plating species, at least one tin plating species and at least one complexing agent and further, if the alloy contains at least one chalcogen, at least one chalcogen plating species.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.