Light emitting diode package structure and manufacturing method thereof
US9263647B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2013 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Jun 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0361
Abstract
Various examples of a light emitting diode (LED) package structure and a manufacturing method thereof are described. In one aspect, a LED package structure includes a carrier, a LED chip, a first annular barricade, a second annular barricade and a fluorescent encapsulant. The LED chip is electrically connected to the carrier. The first annular barricade and the second annular barricade are disposed around the LED chip, with the second annular barricade disposed between the LED chip and the first annular barricade. The fluorescent encapsulant is disposed on the carrier and at least covers the LED chip and the second annular barricade. The fluorescent encapsulant includes at least a type of phosphor and at least a type of gel with the phosphor distributed over a surface of the LED chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.