Set top box having heat sink pressure applying means
US9265180B2 · kind B2 · utility
3Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2013 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Jul 23, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Described is an electronic device, including a top frame, a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, a heat sink associated with the thermal pad and a plurality of springs for providing a biasing force that retains the heat sink against the thermal pad, the heat sink including a planar portion surrounding a central depression, wherein the plurality of springs secure the thermal pad of the circuit board between the central depression portion of the heat sink and the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.