Method for reducing damage by harmful organisms in corn cultivation
US9265189B2 · kind B2 · utility
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1References
17Claims
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Key dates
| Filing date | Jul 17, 2013 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Jul 17, 2033 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA01N51/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided is a method for reducing damage by harmful organisms in corn cultivation. Damage by harmful organisms in corn cultivation can be reduced by carrying out the steps of A) ditching a cultivated land; B) seeding with corn a furrow formed in the foregoing step; C) applying to the furrow an aqueous dispersion or aqueous solution of one or more selected from the below-mentioned compound group (I); and D) closing the furrow. Compound group (I): clothianidin, thiamethoxam, imidacloprid or thiacloprid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.