Methods and apparatus for applying adhesives in patterns to an advancing substrate
US9265672B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2012 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Nov 27, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/1002
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Aspects of the methods and apparatuses herein involve applying fluids onto an advancing substrate. The apparatuses and methods herein may provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to an advancing substrate. The fluid application apparatus may include a slot die applicator and a substrate carrier. The slot die applicator may include a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip. And the substrate carrier may be adapted to advance the substrate past the slot die applicator as the slot die applicator discharges adhesive onto the substrate. In operation, when a first surface of the substrate is disposed on the substrate carrier, the substrate carrier advances a second surface of the substrate past the slot opening of the slot die applicator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.