System and method for forming bonded substrates
US9266105B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2014 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Sep 5, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1741
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for bonding two substrates includes a first roller, a second roller that forms a nip with the first roller, a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously, and a controller. The controller operates the substrate transport to move the first substrate and the second substrate through the nip simultaneously, with a pattern of a hydrophobic material on a first side of the first substrate engaging a first side of the second substrate. The first substrate engages the first roller, which has a higher temperature than the second roller, and the hydrophobic material penetrates the first and second substrates to bond the substrates together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.