Bondline embedded current sensor
US9267906B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2014 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Aug 22, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/40
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for monitoring electrical current passing through a cured bondline may include a current sensor network embedded in an adhesive layer of the cured bondline. The current sensor network may include a plurality of inductive coils and a plurality of current sensor nodes electrically interconnecting the inductive coils to form a plurality of current sensor loops generating induced current in response to a magnetic field associated with an electrical current passing through the adhesive layer. The current sensor nodes may generate current signals representative of the induced current. The current sensor network may include a digital data communications network located external to the cured bondline and receiving the current signals from the current sensor nodes and detecting and monitoring electrical current passing through the cured bondline based on the current signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.