Layer having a non-linear taper and method of fabrication
US9268089B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2014 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | May 5, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for forming a non-linear thickness-profile in a first layer of a first material is disclosed. The method comprises forming an accelerator layer of a second material on the first layer and forming a mask layer disposed on the accelerator layer, wherein the mask layer enables the accelerator layer to expose the first layer to a first etchant in a first region, where the exposure time for each point along a first axis varies non-linearly as a function of distance from a first point on the first axis. Since the time for which the first layer is exposed to the first etch in the first region is non-linear, the thickness of the first layer in the first region changes non-linearly along the first axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.