Forming conductive metal pattern using reactive polymers
US9268223B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2013 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Dec 13, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A conductive metal pattern is formed in a polymeric layer that has a reactive polymer that comprises (1) pendant groups that are capable of providing pendant sulfonic acid groups upon exposure to radiation, and (2) pendant groups that are capable of reacting in the presence of the sulfonic acid groups to provide crosslinking. The polymeric layer is patternwise exposed to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising pendant sulfonic acid groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions. The electroless seed metal ions are reduced to provide a pattern of electroless seed metal nuclei that are then electrolessly plated with a conductive metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.