Mobile computing device dock station with headset jack heat pipe interface
US9268376B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2013 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Feb 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20336
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An improved electronic communications system 100 features a holder assembly 104 such as a mobile computing device dock station 106 and dock heat exchanger providing an external heat sink 162 which when coupled with a user-friendly heat transfer device 164 such as a heat pipe can transfer heat from internal electronic components 146, 148 and 154 and an internal heat sink 157 of an electronic communications device 102, such as a cellular phone or mobile computing device, via a special headset jack-heat pipe interface 167 to help cool the electronic communications device 102. The electronic communications device 102 can also include one or more thermal couplings 158-160 for coupling and providing a thermal pathway(s) from at least one of the internal electronic components 146, 148 and 154 to the internal heat sink 157.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.