Method of manufacturing solid-state imaging device, solid-state imaging device, and electronic apparatus
US9269735B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2011 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Dec 1, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/807
Abstract
The present disclosure provides a method of manufacturing a solid-state imaging device, including, forming on a first substrate a semiconductor thin film which is to be photoelectric conversion sections, forming driving circuits on a face side of a second substrate, laminating the first substrate and the second substrate by disposing the first substrate and second substrate opposite to each other in a condition in which the semiconductor thin film is connected to the driving circuits, and removing the first substrate from the semiconductor thin film in a condition in which the semiconductor thin film is left on the second substrate side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.