Manufacturing method of solid-state imaging apparatus
US9269744B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2014 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Mar 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
Abstract
To realize simplification of a process of forming hollow portions in a solid-state imaging apparatus, a plurality of light receiving portions is formed on a semiconductor substrate, and color filter layers as hollow portion forming layers are formed above the semiconductor substrate (FIG. 1A). A sealable layer for opening boundary portions of the color filter layers is formed on the color filter layers (FIG. 1B). Hollow portions are formed on side surfaces of the color filter layer by etching using the sealable layer as a mask (FIG. 1C). The sealable layer is heated and softened to connect mutually adjacent sealable layers to form a sealing layer for sealing the aperture regions of the hollow portions (FIG. 1D).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.