Interposer and package on package structure
US9271388B2 · kind B2 · utility
3Cited by
5References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 28, 2013 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Jan 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/042
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat-dissipating interposer includes an insulating base, a plurality of conductive pillars and a thermal conducting frame. The insulating base includes a first surface and an opposite second surface. The conductive pillars are arranged on the insulating base. The conductive pillars protrude from the second surface. The height of the conductive pillars relative to the second surface is greater than the thickness of the insulating base. The thermal conducting frame is placed on the second surface and receives a heat-generating component. The interposer can be used in a package on package structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.