Electronic component mounting method
US9271417B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2011 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Feb 29, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5313
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
When a connected position detecting unit detects that a connected position of a tape reaches a predetermined position in the tape passage, head-feeding of an electronic component provided in a head of the connected new tape is provided. In the head-feeding, a tape feeder feeds the tape such that the electronic component in the head of the new tape is located in a component pickup port. When the connected position detecting unit detects that the connected position of the tape reaches the predetermined position in the tape passage, a mounting head picks up the electronic component from the new tape fed by the head feeding control unit and is mounted on a new board positioned by a board conveying path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.