Cooling device, cooling system, and auxiliary cooling device for datacenter
US9271429B2 · kind B2 · utility
12Cited by
7References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2011 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Oct 28, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/14
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A cooling system for a data center is provided, in which a plurality of servers having exothermic electronic components is installed in a housing. The cooling system includes: a cooling circuit, a main cooling device to cool a cooling medium heated by electronic components, and an auxiliary cooling device to assist the main cooling device in cooling the cooling medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.