Hot runner system sealing arrangement
US9272455B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 29, 2015 |
| Grant date | Mar 1, 2016 |
| Priority date | — |
| Expiry date | Apr 29, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/757
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A sealing arrangement between hot runner components includes a sealing component positioned between a first hot runner component and a second hot runner component having a molding material channel extending therebetween. The sealing component includes an opening through which the molding material channel extends. The sealing component is received in a bore in the second hot runner component such that a portion of the sealing component projects beyond the second hot runner component to create a gap between the first hot runner component and the second hot runner component. The sealing component has a hardness that is greater than a hardness of the second hot runner component and less than a hardness of the first hot runner component. Further, the sealing component has a coefficient of thermal expansion that is proximate to a coefficient of thermal expansion of the second hot runner component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.