Stamping head used for pressing anisotropic conductive film onto ceramic substrate
US9272493B2 · kind B2 · utility
0Cited by
2References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 26, 2012 |
| Grant date | Mar 1, 2016 |
| Priority date | — |
| Expiry date | Jul 12, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2315/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A stamping head includes a stamping portion and a connection portion connected to the stamping portion. The stamping portion includes a top surface and four side surfaces. The stamping head defines a jag extending from a junction between a specific one of the side surfaces and the top surface toward a centre of the top surface. The jag passes through the specific side surface. When the stamping head presses a ACF onto a ceramic substrate, a residual air between the ACF and the ceramic substrate flows outside through the jag.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.