Method of cutting a panel using a starter crack and a glass panel including a starter crack
US9272941B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2013 |
| Grant date | Mar 1, 2016 |
| Priority date | — |
| Expiry date | Mar 8, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The disclosure is directed to a cutting process involving: (a) creating a starter crack using a scribe wheel, (b) application of laser or electrothermal heating, and (c) subsequent cooling from a gas or an aerosol jet, as the laser beam and cooling jet move along the desired cutting line. The cutting process can be implemented for cutting a glass panel or other substrate into a plurality of smaller panels. The starter crack may be created on any of the smaller panels within about 10 mm to about 20 mm from the corner of the smaller panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.