Hot melt assist waterborne adhesives and use thereof
US9273230B2 · kind B2 · utility
7Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2013 |
| Grant date | Mar 1, 2016 |
| Priority date | — |
| Expiry date | Jan 11, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/254
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow microspheres and water. The hot melt assist waterborne adhesive is suitable as a partial or complete replacement to hot melt adhesives for use in converting paper and packaging process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.