Patent · US Active

Process for fungal modification of lignin and preparing wood adhesives with the modified lignin and wood composites made from such adhesives

US9273238B2 · kind B2 · utility

0Cited by

6References

8Claims

0Family size

Inventors

Yaolin ZHANG · Keyano, CA
Dian YANG · Cambridge, US
Xiang Wang · Keyano, CA
Martin Feng · Vancouver, CA
Gilles Brunette · Keyano, CA

Key dates

Filing date	Feb 17, 2012
Grant date	Mar 1, 2016
Priority date	—
Expiry date	Feb 17, 2032

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC12R2001/645
WIPO fieldBiotechnology
WIPO sectorChemistry

Abstract

Disclosed herein are method to modify the lignin with particular fungal species, and procedure to synthesize phenolic adhesives with the modified lignin as raw materials, and the adhesives compositions and methods for making adhesive compositions, and methods for making lingo-cellulosic composites from renewable materials. Four fungi in examples are Lenzites elegans (Spreng.) Pat. (FTK 329A), Phanerochaete cremea (Bres.) Parmasto (FTK 332A), Pycnoporellus alboluteus (Ellis & Everh.) Kotl. & Pouz. (FTK 76A) and Meruliopsis taxicola (Pers.) Bondartsev (FTK 122B). Lignin used in examples are organosolv lignin, Kraft lignin, and ammonium lignosulfonate. The present invention includes methods to (1) modify of lignin with fungi; (2) in-situ polymerize modified lignin-phenol-formaldehyde to generate bio-modified lignin-phenol-formaldehyde adhesive in liquid form, and (3) manufacture composite panels with bio-modified lignin-phenol-formaldehyde resins.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.