Hard film for cutting tool
US9273388B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Mar 18, 2013 |
| Grant date | Mar 1, 2016 |
| Priority date | — |
| Expiry date | Mar 18, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24975
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a hard film for a cutting tool formed on a surface of a base material, the hard film being comprised of a nano multi-layered structure comprising a thin layer A, a thin layer B, a thin layer C and a thin layer D or a structure in which the nano multi-layered structure is repeatedly stacked at least twice, wherein the thin layer A is comprised of Ti1-xAlxN (0.5≦x≦0.7); the thin layer B is comprised of Al1-y-zTiyCrzN (0.3≦y≦0.6 and 0<z≦0.3); the thin layer B is comprised of MeN (where Me is Nb or V); and the thin layer D is comprised of Al1-a-bTiaSibN (0.3≦a≦0.7 and 0<b<0.1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.