Chip-to-chip signal transmission system and chip-to-chip capacitive coupling transmission circuit
US9274167B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2013 |
| Grant date | Mar 1, 2016 |
| Priority date | — |
| Expiry date | Jun 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B17/14
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A chip-to-chip signal transmission system is provided, which includes a first chip, a second chip, and a dielectric layer. A signal transmission is performed between a transmitter of the first chip and a receiver of the second chip through a transmission-metal-pad unit and a receiving-metal-pad unit. The transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad unit according to a driving-testing signal when the transmitter receives the driving-testing signal. A first testing unit receives the transmission-testing-coupling signal and outputs a transmission-testing signal according to the transmission-testing-coupling signal. A second testing unit transmits a receiving-testing-coupling signal through the receiving-metal-pad unit according to the driving-testing signal when the second testing unit receives the driving-testing signal. The receiver receives the receiving-testing-coupling signal and outputs a receiving-testing signal according to the receiving-testing-coupling signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.