Patent · US Active

Photonic integration platform

US9274275B2 · kind B2 · utility

20Cited by

3References

7Claims

0Family size

Assignee

Cisco Technology, Inc. · US

Inventors

Mark A. Webster · Bethlehem, US
Ravi S. Tummidi · Weilersville, US

Key dates

Filing date	Jul 3, 2013
Grant date	Mar 1, 2016
Priority date	—
Expiry date	Nov 11, 2033

Classification

Technology area (CPC G)Physics
CPC primaryG02B2006/12152
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A SOI device may include a waveguide adapter that couples light between an external light source—e.g., a fiber optic cable or laser—and a silicon waveguide on the silicon surface layer of the SOI device. In one embodiment, the waveguide adapter is embedded into the insulator layer. Doing so may enable the waveguide adapter to be formed before the surface layer components are added onto the SOI device. Accordingly, fabrication techniques that use high-temperatures may be used without harming other components in the SOI device—e.g., the waveguide adapter is formed before heat-sensitive components are added to the silicon surface layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.